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Mitsubishi Electric Introduces Low Power 10Gb Ethernet Single Chip Transceiver Integrated Circuit to Comply with the Latest Standards

Posted on: Tuesday, 24 February 2004, 06:00 CST

Mitsubishi Electric & Electronics Inc., USA, has introduced a 10Gb Ethernet physical layer (PHY) single chip transceiver integrated circuit (IC) capable of low power operation. The M69850AWG has been introduced to meet the demand for increased data communication capacity required on backbone fiber optic networks, Metropolitan Area Networks (MAN) and Local Area Networks (LAN). The M69850AWG's low power consumption of 1.2W is made possible by using a 100nm gate-width SOI-CMOS(a) process and the novel high frequency circuit design technique, integrating PMA(b), PCS(c) and XGXS(d) functions onto a single chip. ¶ Suitable for 10Gb XENPAK/X2/XPAK transceiver modules and 10Gb XFP platform, the product complies with the latest requirements of three industry standards of the 10Gb Ethernet standard(e), the 10Gb Fiber Channel standard(f) and the XENPAK MSA standard(g). ¶ With the SOI-CMOS process, as the channel layer and the substrate layer are physically isolated by silicon oxide, the parasitic capacitance of the transistor is reduced and faster operation at a reduced power consumption of the M69850AWG is made possible. Furthermore, the SOI-CMOS technology enables high noise immunity and a physically latch-up free product that is suitable for 10Gb XENPAK/X2/XPAK transceiver modules. ¶ The M69850AWG is housed in a high performance small BGA(h) (14x14x1.7mm) in order to conform to X2/XPAK space and heat requirements. Available from March 1, 2004, the new IC is priced at $330 each in sample quantities.

¶ (a) Silicon-On-Insulator: Complimentary Metal Oxide Semi-conductor

¶ (b) Physical Media Attachment (transceiver block of 10Gb serial interface) ¶ (c) Physical Coding Sub layer (10Gb Ethernet standard coding/decoding block) ¶ (d) 10(X)G eXtension Sub layer (transceiver block of 3.125Gbps 4-Lane parallel interface) ¶ (e) IEEE802.3ae (Final version): a data communication standard for computer and workstation local area networks ¶ (f) T11.2 10GFC (Revision 3.5): a data communication standard for computer and workstation storage area networks ¶ (g) XENPAK MSA (Revision 3.0): consortium aiming to define product outlining and interfacing ¶ (h) BGA: Ball Grid Array

¶ Mitsubishi Electric Semiconductor Division

¶ A top-10 global leader in Optical, High Frequency and Power compound semiconductors, Mitsubishi Electric Semiconductor Division offers a well-balanced portfolio of semiconductors to meet major system-level requirements. The Semiconductor Division helps the world's leading manufacturers and suppliers get to market faster, more competitively, and at lower overall cost with semiconductor solutions for automotive, communications, networking, industrial and consumer electronics. Mitsubishi Electric Semiconductor Division's advanced GaAs and InP products provide unmatched flexibility, design reuse, innovative packaging options, ultra low power and proven high quality across a wide range of technologies. For more information about Mitsubishi Electric Semiconductor Division, visit www.mitsubishichips.com.

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